- Diamond wire for sapphire and silicon cutting
- 2017-12-21 21:33
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Model Number: D0.10~D0.50
Brand Name: XINYA
Key Specifications/Special Features:
Electroplated diamond wire is a type of fixed abrasive diamond wire. It's used for cutting semiconductors material, such as silicon, sapphire. Based on the abrasi...
- Diamond grinding wheel for semiconductor
- 2017-11-23 10:07
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Model Number: D100~D500
Brand Name: XINYA
Key Specifications/Special Features:
Resin diamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors materia...
- Diamond polishing discs
- 2017-10-08 20:58
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Model Number: D100-200-62-#0113
Brand Name: XINYA
Key Specifications/Special Features:
Diamond polishing discare special used for polishingtungsten carbide,ceramic, glass and more.Semi-conductors material, such as silicone, sapphireSpecial diamo...
